SHENZHEN, China – September 9, 2026 — The 27th China International Optoelectronic Exposition (CIOE 2026) officially kicked off today at the Shenzhen World Exhibition & Convention Center (Bao’an). Marking its 10th anniversary, Attach Point (APIE)—a pioneer in high-precision die attach and advanced packaging solutions—made a strong showing at Booth 10B69 (Hall 10), showcasing a decade of R&D milestones and cutting-edge packaging platforms.
The APIE booth drew significant industry attention on Day 1, with live equipment demonstrations and end-to-end solutions driving high foot traffic and active technical exchanges.
Enabling High-Speed Optical Transceiver, NPO & CPO Manufacturing
Fully Automated In-Line COB Packaging Solution for 800G / 1.6T Applications
To address critical bottlenecks in high-speed optical module volume manufacturing—such as fragmented process steps, manual handling yield loss, and prolonged changeover times—APIE showcased a live, fully integrated 9-machine automated inline demonstration.
Seamless Process Integration: Integrates die attach, detection, curing, plasma, and wire bonding into a cohesive closed loop, ensuring robust process control and maximum yield stability.
Full-Traceability & Factory Automation: Fully compliant with Wafer/Strip Mapping, OCR tracking, and SECS/GEM protocols to eliminate cross-process data gaps and provide end-to-end traceability.
Flexible & Rapid Deployment: Standard SMEMA interfaces enable flexible production line configurations, drastically shortening time-to-production and accelerating high-volume delivery for 800G and 1.6T optical transceivers.
Powering Compute: Advanced Packaging for HBM, CoWoS & Wafer-Level Fan-Out
Advanced Packaging Suite: NUERA PRO / VULCAN PRO / GEMINI PRO
To meet the stringent thermal and mechanical demands of AI accelerators, High-Bandwidth Memory (HBM), and 2.5D/3D heterogenous integration (CoWoS / Wafer-Level Fan-Out), APIE presented its flagship high-precision bonding solutions: NUERA PRO, VULCAN PRO, and GEMINI PRO.
Sub-Micron Precision: Delivering ultra-high placement accuracy (±1 to 2 μm) and supporting 16Hi+ ultra-thin multi-die stacking architectures.
Overcoming Core Packaging Hurdles: Built-in advanced process capabilities systematically tackle major advanced packaging pain points, including thermal warpage control, flux residue mitigation, and yield degradation during fine-pitch interconnects.
From R&D to HVM: Seamlessly bridges the gap between NPI (New Product Introduction) and high-volume manufacturing, providing a solid yield defense for high-end packaging architectures.
The exhibition runs through September 11. APIE’s technical experts are on-site at Hall 10, Booth 10B69 providing live platform walk-throughs and in-depth technical consultations. We warmly invite industry leaders, packaging engineers, and partners across optical communications, high-density memory, and AI chip manufacturing to visit our booth and explore the future of precision advanced packaging.
Event Details
Booth: 10B69 (Hall 10)
Dates: September 9–11, 2026 | 09:00 – 17:00
Venue: Shenzhen World Exhibition & Convention Center (Bao’ an), Shenzhen, China
