APIE is a global manufacturer of high-technology equipment, specializing in precision pick & place and advanced packaging solutions for semiconductor back-end and micro-component assembly. Our service network spans Singapore, the United States, Japan, China, and other countries, offering comprehensive technical support and considerate services worldwide.

At APIE, our core team comprises top experts from renowned semiconductor giants such as YAMAHA, HITACHI, ASMPT, BESI, K&S, TDK, Goertek, and Keyence. Additionally, we have elite engineers from leading R&D institutions including the Chinese Academy of Sciences, China Academy of Aerospace Sciences, the National Energy Laboratory of the United States, the Hong Kong University of Science and Technology Innovation Center, and the Harbin Institute of Technology.

Since our establishment, APIE has continuously invested in core technologies such as motion control, precision machinery, thermosetting flow simulation, optical imaging, micro-nano motors, and industrial software. We conduct cutting-edge research on semiconductor back-end processes, innovating new generations of semiconductor packaging equipment such as ultra-thin-die stacking bonders, smart inline solutions for CIS-COB processes, and advanced bonders for multi-chip/module attachment. This commitment has earned us recognition and trust from leading semiconductor OSATs and IDMs.

With a mission to facilitate the upgrade of the global precision intelligence manufacturing industry, APIE aims to be the global leader in precision pick & place technology. We focus on our customers and strive to provide more micro-nano high-tech equipment for semiconductor advanced packaging.