APIE is a global manufacturer of high-technology equipment specializing in advanced semiconductor packaging systems such as thermo-compression bonder (TCB) and wafer-level hybrid bonding (HB). Holders of bachelor’s, master’s, and doctoral degrees account for over 52% of our workforce. Our systems are used primarily in advanced packaging for HBM (high-bandwidth memory), high-performance CPUs/GPUs, and 2.5D/3D packaging for AI chips. Headquartered in Dongguan, we maintain branches and service teams in Singapore, the United States, Japan, Malaysia, and across Europe. The company holds nearly 100 patents and has been recognized as a national-level “Little Giant” SEM (Small and Medium Enterprises) — top performers among specialized, high-end and innovation-driven SMEs as well as being designated the Guangdong Provincial Engineering Technology Research Center for Semiconductor Packaging Equipment.

Since its establishment, APIE has consistently invested in core technologies—including motion control, precision machinery, thermo flow simulation, optical imaging, micro-nano motor, and industrial software—and has delivered a new generation of advanced packaging solutions that comprehensively cover all die-attach processes. We conduct cutting-edge research on semiconductor back-end processes, developing innovative solutions such as 

Smart inline solutions for CIS-COB processes
Ultra-thin die stacking bonders
3D multi-layer stacking thermo-compression bonders (TCB).

APIE’s core technical and management team comprises seasoned experts from leading global semiconductor companies, each with 10 to 30 years of industry experience on average. Backed by a world-class founding team and a track record of high-quality delivery and service, APIE has earned recognition from top-tier semiconductor OSATs, IDMs, and camera-module manufacturers worldwide. With stable HVM (high-volume manufacturing) capacity, we are committed to creating value for our clients.

With a mission to drive the advancement of global precision intelligent manufacturing, APIE aims to become a global leader in precision pick-and-place technology. We remain customer-focused and strive to provide innovative micro-/nano-scale, high-tech equipment for advanced semiconductor packaging.