APIE is a global manufacturer of high-technology equipment, specializing in precision pick & place and advanced packaging solutions for semiconductor back-end and micro-component assembly. Our service network spans Singapore, the United States, Japan, China, and other countries, offering comprehensive technical support and considerate services worldwide.

Since our establishment, APIE has continuously invested in core technologies such as motion control, precision machinery, thermosetting flow simulation, optical imaging, micro-nano motors, and industrial software. We conduct cutting-edge research on semiconductor back-end processes, innovating new generations of semiconductor packaging equipment such as ultra-thin-die stacking bonders, smart inline solutions for CIS-COB processes, and advanced bonders for multi-chip/module attachment.

APIE's core technical and management team is comprised of seasoned experts from leading global semiconductor companies, each possessing 10 to 30 years of industry experience. Driven by our professional founding team, cutting-edge product technology, and mature solutions, we deliver superior quality and service that have been recognized by top-tier semiconductor OSATs, IDMs, and CMIs both domestically and internationally. Equipped with the capacity for continuous and stable mass production, we are committed to creating core value for our clients.

With a mission to facilitate the upgrade of the global precision intelligence manufacturing industry, APIE aims to be the global leader in precision pick & place technology. We focus on our customers and strive to provide more micro-nano high-tech equipment for semiconductor advanced packaging.