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AP-Smart Inline
Semiconductor Packaging Intelligent Inline Solution
  • High Precision

    ±10um Placement

    Die Attach & Flip Chip

    0 Defect for Automotive Application

  • High Stability

    High Cleanness Control Class 10

    Dispensing Process Expertise

    7+ Years Stable & Reliable HVM

  • High Speed

    +30% High Throughput

    Continuously Mass Production

    Fully Automated Load/Unload

  • High Intelligence

    Flexible Configurations

    SECS/GEM Traceability

    Turnkey Solution

Item Specifications
End Market Consumer/Automotive
Application CCM/Automotive/IOT-COB, 3D-ToF, Fingerprint Sensor, IR Camera Module, VCM etc.
Material Handling 4~12" Wafer, JEDEC Tray, Waffle Pack, etc.
Process Dispensing, Jetting, Stamping, DAF
Die Placement ±10um @3σ
UPH Material Dependent
Footprint & Weight Configuration Dependent
Remark: Material dependent, option or accessory may be required
AP-M2000 Series
Ultra-Thin-Die Stacking Bonder
  • ±5um

    Placement

  • 25um

    Thin Die

  • 32-Hi

    Stacking

  • Class

    100

  • High Precision

    ±5um Placement

    Frictionless Precise Force Control

    Vibration Suppression

  • High Stability

    25um Die Thickness

    32-Hi Stacking

    Key OSAT/IDM Running HVM

  • High Speed

    Leading UPH & OEE

    Customized Functions

    DAF & Epoxy Writing

  • High Intelligence

    Crack Free

    Deep Learning Driven Vision

    Support Industry 4.0

Item Specifications
Wafer 6" ~ 12"
Die Size 0.8 ~ 25mm
Die Thickness ≥ 25um
Strip Length 130 ~ 300mm
Strip Width 55~100mm (Optional <55mm )
Bond Force 0.5 ~ 50N (70N optional)
Die Placement ±5um @3σ
Item Specifications
Process DAF & Epoxy Dispensing
Cycle Time Material Dependent
Heater Block Max 250 ℃ (±5 ℃)
Die Stacking YES
Packages BGA/QFP/QFN
Footprint 2292 x 1551 x 1900mm
Weight 2450kg
Remark: Material dependent, option or accessory may be required
AP-3500 Series
Advanced Bonder for Multi Chip/Module Attach
  • ±3um

    Placement

  • +20%

    UPH

  • High

    Flexibility

  • Small

    Footprint

  • High Precision

    ±3um Placement

    Qualified in Worldwide #1 Account

    Advanced Packaging Solution

  • High Stability

    Optional High Force 50kg

    Pre-Sintering SiC Die Attach

    Modulization Design

  • High Speed

    Die Attach + Flip Chip, Stack Die, Multi Chip Mount

    On The Fly Post Bond Inspection

    Dual Mode (Speed/Precision)

  • High Intelligence

    Excellent Cleanliness Control

    SECS/GEM Traceability

    Support Industry 4.0

Item Specifications
Material Handling 6~12" Wafer, JEDEC Tray, Feeder, Waffle Pack, Gel-Pak, etc.
Support All Chip Trays, Substrates, Leadframes and Carriers
Die Size 0.17 ~ 50mm
Die Thickness ≥ 60um
Bond Force 0.3 ~ 50N  (Optional to 500N)
Die Placement Down to ±3um@3σ (±5um/±7um Configuration Dependent)
Process Die Attach, Flip Chip, Stack Die, Multi Chip Mount
Cycle Time Material Dependent
Footprint 1200 x 1650 x 2050mm
Remark: Material dependent, option or accessory may be required
Contact
  • Address: Building 9, Songshan Lake Industrialization Center,
    Alishan Road, Songshan Lake Park, Dongguan City,
    Guangdong Province
  • Tel: +65 9349 9866(Bert)

Copyright © Dongguan Attach Point Intelligent Equipment CO., Ltd.  All Rights Reserved. Bomin

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