• ±7μm Placement
• Cpk ≥ 1.67
• 0 Defect for Automotive Application
• Vibration Suppression Technology
• Real-Time Correction Technology
• Years of Stable & Reliable HVM
• +20% High Throughput
• Enhanced Overall OEE
• MES Traceability
• Unmanned Automation Line
• Automotive COB Process
| Item | Specifications |
| End Market | Consumer / Automotive |
| Application | Smartphone / Automotive CMOS Modules, LiDAR Modules |
| Material Handling | 4~12" Wafer, JEDEC Tray, Waffle Pack etc. |
| Process | COB, BGA, DAF |
| Die Placement | XY: ≤±7μm@3σ; θ: ≤±0.1°@3σ |
| UPH | ≥2200 (Smartphone COB, ≥36 pcs / Strip); ≥1000 (Automotive COB, ≥18 pcs / Strip) |
| Footprint & Weight | Configuration Dependent |
Placement
Thin Die
Stacking
Class
• ±5μm Placement
• Friction-Free Precise Force Control
• Vibration Suppression
• 25μm Die Thickness
• 32-Hi
• Key OSAT / IDM Running HVM
• Leading UPH & OEE
• Compatible with All DRAM & Flash Processes
• Support DAF & Epoxy
• Patented Crack-Free Technology
• Deep Learning AOI
• Support Industry 4.0
| Item | Specifications |
| Wafer | 6"~12" |
| Die Size | 0.8~25mm |
| Die Thickness | ≥25μm |
| Bond Force | 0.5~50N (70N Optional) |
| Die Placement | ±5μm@3σ |
| Process | DAF & Epoxy |
| UPH | Material Dependent |
| Item | Specifications |
| Strip Length | 130~300mm |
| Strip Width | 55~100mm (Optional <55mm) |
| Heater Block | Max 250°C (±5°C) |
| Die Stacking | YES |
| Packages | BGA / QFP / QFN etc. |
| Footprint (mm) | 2292x1551x1900 (LxDxH) |
| Weight | 2450kg |
Placement
Industry 4.0
Multi-chip Mounting
Material Traceability; Self-Diagnosis
• XY Placement: ±3μm@3σ
• Theta Rotation: 0.07°@3σ
• Force Control: 0.1-10N±10%
• Precise BLT Control
• Industry-Leading UPH
• Extremely User-Friendly
• High Speed Mode with ±10μm Placement
• Easy Process Changing
• Easy Product Conversion
• Auto Tool Changing
• Support SECS / GEM, Inline, OHT, AGV
• Post-Disp / Bond Smart Inspection
• FM / Crack Detection
• Self-Diagnosis
| Item | Specifications |
| Application | Photonics, Transceiver, SiP, LIDAR, Camera Module, etc. |
| Die Size | 0.15-25mm |
| Die Thickness | 0.025-7.0mm |
| Bond Force | 0.1-10N±10% |
| Die Placement | ±3μm@3σ |
| Attach Process | COB, FC, DA with Epoxy / Silver Paste / UV Glue |
| Item | Specifications |
| Substrate | L: 130-260mm x W: 55-140mm |
| Material Handling | FR4, Leadframe, Strips, Carrier, Boat, Ceramics, 6"-12"Wafer, Gel-pak, Waffle Pack, Tray, Feeder |
| Bondhead | 6 Collets Auto Changing, Heating, UV, Confocal Height Measurement |
| Ejector System | 5 sets Auto Changing |
| Footprint(mm) | 1240x1553x2060 (LxDxH) |
Placement
UPH
Stacking
Class
• Placement Accuracy: TC ±2μm@3σ
• Tilt Control: ≤2μm@10mm
• Compatible for TC-MUF, MR-MUF and FC Processes
• Single TCB UPH > 500, Dual TCB UPH > 1000 with 4s Bond Time
• Fast Device Conversion in 4 hours
• EFEM with Multi-loadports
• Low Temperature Atmospheric Plasma to Remove Metal Oxide
• Wafer-level / Chip-level Plasma Treatment (Both Sides)
• N2 Shielding (O2 < 50ppm), Precise Chamber Temperature Control
• No Flux Cleaning, Suitable for Fine Pitch Flip Chip Bonding
• Compatible with Both Flux Dipping and Fluxless Modes
• Compatible with CoW / CoS / Panel
• Compatible with Wafer / Tape & Reel / Tray Loading
• Compatible with Face-up & Face-down modes
• Single TCB / Dual TCBs / TCB-Vacuum Formic Acid Reflow System
| ITEM | SPECIFICATIONS |
| Applications | CoWoS, HBM |
| Die Size | Up to 26x33mm |
| Die Thickness | ≥25μm |
| Bond Force | 0.7-50N |
| Chip-Stacking | Yes |
| Process | FC, DA, 90°, Flux Dipping |
| UPH | Single TCB >500; Dual TCBs >1000 (Bond Time 4s) |
| ITEM | SPECIFICATIONS |
| Material Handling | 12" Wafer, Substrate, Panel |
| Ejector System | Multi-Zone Ejector System |
| MES | SECS / GEM, Full Traceability |
| Tool Changing | Automatic Nozzle and Ejector Change |
| Inspection System | PBI / Particle & Die Crack Detect |
| Footprint (mm) | 3830x2270x2800 (LxDxH) Single TCB |
Placement
UPH
Stacking
Class
• Placement Accuracy: TC ±1μm@3σ
• Active Tilt Control: ≤2μm@10mm
• Compatible for TC-MUF, MR-MUF and FC Processes
• Single TCB UPH >450, Dual TCB UPH >900 (TC Process Time 5s)
• Fast Device Conversion in 4 hours
• EFEM with Multi-loadports
• Low Temperature Atmospheric Plasma to Remove Metal Oxide
• Wafer-level / Chip-level Plasma Treatment (Both Sides)
• N2 Shielding (O2 < 100ppm), Precise Chamber Temperature Control
• No Flux Cleaning, Suitable for Fine Pitch Flip Chip Bonding
• Compatible with Both Flux Dipping and Fluxless Modes
• Compatible with CoW / CoS / Panel
• Compatible with Wafer / Tape & Reel / Tray Loading
• Compatible with Face-up & Face-down modes
• Single TCB / Dual TCBs / TCB-Vacuum Formic Acid Reflow System
| ITEM | SPECIFICATIONS |
| Applications | CoWoS, HBM |
| Die Size | Up to 26x33mm |
| Die Thickness | ≥25μm |
| Bond Force | 0.7-50N |
| Chip-Stacking | Yes |
| Process | FC, DA, TC Fluxless, TC Flux Dipping |
| UPH | Single TCB >450; Dual TCBs >900 (TC Process Time 5s) |
| ITEM | SPECIFICATIONS |
| Material Handling | 12" Wafer, Substrate, Panel |
| Ejector System | Multi-Zone Ejector System |
| MES | SECS / GEM, Full Traceability |
| Tool Changing | Automatic Nozzle and Ejector Change |
| Inspection System | PBI / Particle & Die Crack Detect |
| Footprint (mm) | 3830x2270x2800 (LxDxH) Single TCB |
Placement
UPH
Stacking
Class
• Placement Accuracy: DA ±2μm@3σ
• Tilt Control: ≤2μm over 10mm
• Supports DAF face-up bonding process
• Single TCB UPH > 500, Dual TCB UPH > 1000 with 4s Bond Time
• Fast Device Conversion in 4 hours
• EFEM with Multi-loadports
• Auto Change Collect & Ejector
• DAF Thickness Down to 7.5μm
• Particle & Die Crack & Coplanarity Detection
• Compatible with CoW
• Compatible with Wafer / Tape & Reel / Tray Loading
• Single TCB / Dual TCBs
| ITEM | SPECIFICATIONS |
| Applications | VFO; CoWoS-L AB0 |
| Die Size | Up to 26x33mm |
| Die Thickness | ≥25μm |
| Bond Force | 0.7-50N |
| Chip-Stacking | Yes |
| Process | DA |
| UPH | Single TCB >500; Dual TCBs >1000 (Bond Time 4s) |
| ITEM | SPECIFICATIONS |
| Material Handling | 12" Wafer |
| Ejector System | Multi-Zone Ejector System |
| MES | SECS / GEM, Full Traceability |
| Tool Changing | Automatic Nozzles and Ejector Change |
| Inspection System | PBI / AOI / Particle / Coplanarity / Die Crack |
| Footprint (mm) | 3830x2270x2800 (LxDxH) Single TCB |
