July 7-8, 2026 – APIE successfully hosted its Class of 2026 "Young Talents Program" onboarding bootcamp at its headquarters. Under the theme "Crafting the Core, Equipping the Future," the program welcomed 19 top graduates from key national universities into core mechanical, software, and electrical engineering roles within the R&D Center.
This signature program features a structured 6-month framework designed to accelerate graduate onboarding and transition them from "campus peers" to "APIE professionals." As an R&D-driven enterprise with nearly one-third of its staff in R&D, this new cohort brings APIE’s Master’s and Ph.D. talent ratio to 60%, significantly strengthening its talent pipeline in advanced semiconductor packaging equipment.
Executive Insights: Long-Term Value and a Closed-Loop Mindset
At the opening session, CEO Danny Yang and COO Dickson Wu shared critical career guidance with the cohort:
- Drawing from his 20+ years in the semiconductor industry, Danny Yang urged graduates to focus on long-term industry value. He emphasized maintaining strategic patience through industry cycles and growing in lockstep with APIE by boldly voicing unique insights.
- COO Dickson Wu introduced a 4-phase framework for professional excellence: Requirement Alignment, Execution Driving, Outcome Feedback, and Post-Mortem Optimization. He highlighted that proactive upward communication is vital to building team trust and ensuring results.
Mentorship: A Structured 6-Month Development Journey
Following HR-led orientation and team-bonding icebreakers, the bootcamp featured a formal Mentorship Ceremony. Mentors presented new hires with corporate lapel pins, and graduates honored their mentors with traditional tea.
