SHENZHEN, China – September 11, 2026 — The 27th China International Optoelectronic Exposition (CIOE 2026) concluded today following three days of dynamic industry engagement at the Shenzhen World Exhibition & Convention Center.

Marking its 10th anniversary, APIE—a participant in high-precision die attach and advanced semiconductor packaging systems—presented its latest technological milestones to a global audience. We extend our sincere gratitude to all clients, ecosystem partners, and industry peers who visited our booth to explore collaborative opportunities and discuss the future of precision smart manufacturing.

Live 9-Machine In-Line COB Solution Redefines High-Speed Optical Packaging

Taking center stage was the live debut of APIE’s fully integrated 9-machine automated Chip-on-Board (COB) packaging line, engineered specifically for high-speed optical transceivers. Demonstrating a seamless, closed-loop workflow across die attach, inspection, curing, plasma cleaning, and wire bonding, the line directly addresses high-volume manufacturing challenges. With end-to-end data traceability and flexible modular configuration, the demonstration underscored APIE’s capability to accelerate high-yield production for 800G/1.6T modules.

Advanced Packaging Suite Powers AI Accelerators and HBM Architectures

To address escalating compute demands, APIE highlighted its flagship advanced packaging equipment suite—NuEra Pro, Vulcan Pro, and Gemini Pro. Engineered for AI compute chips, High-Bandwidth Memory (HBM), and 2.5D/3D heterogenous integration (including Wafer-Level Fan-Out and CoWoS), the portfolio drew substantial attention from memory and optical interconnect specialists. Visitors engaged in deep technical discussions around the systems' ultra-high placement accuracy, multi-die stacking, and breakthrough fluxless bonding capabilities designed to tackle thermal warpage and fine-pitch interconnect bottlenecks.

A Decade of Precision. Engineering What’s Next.

As APIE celebrates ten years of continuous innovation, our dedication to pushing the boundaries of packaging precision remains stronger than ever. Moving forward, we will continue to partner closely with semiconductor and optoelectronic leaders worldwide to overcome critical process bottlenecks and accelerate high-yield, high-volume manufacturing.

We look forward to connecting with you at our upcoming global industry events!