[March 27, 2026–SHANGHAI] – After three days of high-energy networking and industry-shaping discussions, APIE has officially concluded its showcase at SEMICON China 2026. Held at the SNIEC, this year’s event centered on the rapid evolution of chip technology in the AI era—a challenge APIE is meeting head-on with its latest advanced packaging solutions.

Under the theme “Connecting the Future: Intelligent Die-Stacking,” APIE’s booth became a hub for discussing the next generation of System-in-Package (SiP) and advanced integration.

A standout at the APIE booth was the live demonstration of the AP-M3500. Industry engineers and plant managers gathered to see the system’s deep integration with Automated Material Handling Systems (AMHS).

For the AI and high-performance computing markets, APIE’s AP-TC2000 demonstrated its leadership in complex 2.5D/3D integration by balancing power with incredible precision. AP-TC2000 pairs ultra-fine force control (from 0.7-50N) for protecting delicate components like HBM with rapid thermal cycling capabilities—hitting heating rates of ≥200℃/s and cooling at ≥-70℃/s. This level of agility effectively eliminates substrate warpage, ensuring the high-density yields required for advanced chip architectures.

More Than Just Technology

At APIE, we believe the best innovations come from collaboration. Throughout the week, our CEO Dr. Yang and our expert team were on the floor, engaging in meaningful conversations with peers and partners about the physics of bonding and the future of the industry.