[SHANGHAI – March 25, 2026] – As SEMICON China kicks off today at the New International Expo Centre, APIE is center stage, showcasing the hardware backbone of the AI revolution.

Led by CEO Dr. Yang, the APIE team is onsite at Booth T3-173, showcasing advanced packaging systems designed to solve the most pressing scaling challenges in HBM/CoWoS and high-speed optical networking. In an industry racing toward trillion-parameter models, APIE provides the precision and reliability needed to turn theoretical AI performance into high-yield reality.

Meeting the Scaling Challenge: Precision Where It Matters Most

The recent IEEE ECTC 2026 summit highlighted a critical truth: packaging is no longer just "the back end"—it is the gatekeeper of AI performance. At SEMICON, APIE is addressing the industry's most urgent bottleneck: achieving sub-micron alignment without sacrificing high-volume throughput.

The Portfolio: Powering the Next Generation of Compute

1. [AP-TC2000] TCB

Engineered for the complexities of AI chip production, the AP-TC2000 delivers an industry-leading ±1.5μm @ 3σ accuracy. Optimized for TCB-Fluxless processes, it features an advanced thermal-force compensation system specifically designed to eliminate the warpage issues that plague high-layer HBM stacks. For 2.5D and 3D integration, it is the definitive solution for maximizing yield.

2. [AP-M3500 ^Series]: The Future of Inline Optical Packaging

For high-speed optical modules, the AP-M3500 offers a versatile, high-precision multi-die placement platform. With ±3μm accuracy, automatic 6-collet exchange, and multi-material handling, the system is built for the Industry 4.0 era. It enables a fully automated, "lights-out" manufacturing environment, allowing customers to scale mass production with surgical precision.

Visit Us at Booth T3-173

We invite you to join us at our booth to see the AP-M3500 in action and discuss how we can help accelerate your next-generation packaging roadmap.