April 11, 2026 — Attach Point Intelligent Equipment (APIE) has once again been spotlighted by China’s national broadcaster, CCTV-2. On the April 10th episode of the flagship program Economic Half Hour, titled "Economic Variables: Memory Price Fluctuations," APIE was featured as a key innovator driving technical breakthroughs in the global semiconductor supply chain.
In the micron-scale world of semiconductor packaging, the precision of every "attach point" defines the ceiling of computing power. As a leader in sub-micron high-precision assembly, APIE is positioning itself as an essential technical partner in the global AI ecosystem.
Capitalizing on the AI Super-Cycle
The surge in AI infrastructure has fundamentally reshaped market dynamics. Speaking to CCTV, Dr. Danny Yang, CEO of APIE, noted the unprecedented pace of growth: "We are seeing a massive spike in AI demand, with Q1 market requirements jumping more than 60% year-over-year. This is a significant expansion by any industry standard." At the heart of this transition is High Bandwidth Memory (HBM). To unlock the full potential of AI chipsets, advanced packaging is no longer optional—it is the critical enabler.
Inside APIE’s high-security R&D labs, the team is accelerating the development of proprietary core equipment specifically engineered for HBM modules. Dr. Yang identified this as the "latest generation of memory packaging technology," noting that APIE’s systems are designed to "meet the most stringent international production requirements for HBM."
This dedication to precision and stability is more than a technical milestone; it is a validation of APIE’s commitment to independent innovation and its ability to navigate the most challenging frontiers of high-end semiconductor manufacturing.
From Technical Leadership to Market Momentum
APIE’s technical edge has translated directly into commercial success. The company has seen a substantial increase in orders for memory packaging equipment this year, reflecting its specialized market position.
"Currently, we are the only domestic manufacturer capable of producing this specific class of equipment," Dr. Yang stated. This breakthrough fills a critical gap in the high-end packaging landscape, signaling APIE’s readiness to support the industry with mature, high-reliability solutions.
Connecting the World, Leading the Future
APIE extends its gratitude to the CCTV-2 Economic Half Hour team for their in-depth coverage.
Moving forward, APIE remains committed to the sub-micron high-precision domain. As the global demand for AI compute and HBM integration intensifies, APIE will continue to deliver competitive, high-performance equipment to power the next era of the semiconductor industry.
