We are honored to join CIOE 2025 in Shenzhen , The influential platforms that bring together cutting-edge technologies and global industry leaders.
APIE remains customer-centric and product-driven, with deep technical expertise. We are committed to delivering high-precision, high-throughput, high-stability, and intelligent advanced-packaging solutions.
Across the show, we will showcase four application scenarios that address real-world challenges and create tangible value:
Automotive / ADAS — AP-Smart Inline intelligent packaging line, achieving ±7 µm bonding accuracy with production-proven stability, helping build a robust technical safeguard for intelligent driving.
Memory — AP-M2000 Series 3D ultra-thin die stacking bonder, ±5 µm accuracy and 32-layer stacking, setting a new domestic benchmark and enabling R&D and mass production of high-density memory.
Optical Communications — AP-M3500 multi-Chip SiP Die Bonder, ±3 µm placement accuracy, supporting Flip-Chip / Eutectic processes, delivering scenario-based solutions for high-speed/high-reliability requirements across diverse applications.
AI Chips — AP-TC2000 wafer-level thermo-compression bonder, ±1.5 µm accuracy and 12Hi+ stacking, ensuring consistent quality control and driving AI innovation and energy-efficiency improvements.
✨ Reshaping connectivity in optical communications; empowering the future with advanced packaging.
✨ Exploring breakthroughs together; shaping a new chapter for the industry.
Shenzhen: Shenzhen World Exhibition & Convention Center (Bao’an New Hall), Hall 10 · Booth 10C11
We sincerely invite you to meet us onsite!
