Earlier this month, APIE welcomed the 2025 cohort of our Eagle Program—a 3-day on boarding and mentorship experience themed “Spark the Chip, Shape the Future”.

Fresh graduates from across China gathered at China HQ, stepping into the world of advanced semiconductor packaging and experiencing firsthand what it means to be part of a fast-growing, innovation-driven company.

 
Highlights included:
🔹 Immersive training on industry fundamentals, tools, and values.
🔹 A keynote from Chairman Mr. Chen on curiosity, grit, and precision.
🔹 Cross-functional workshops on communication, strategy, and real-world problem solving.
 
One of the most memorable moments：The mentorship pledge ceremony, where each new hire was paired with a senior mentor and committed to a structured “1+1+3” journey—1 week of job immersion, 1 month of technical training, and 3 quarters of project-based learning.
 
The stories shared—about fixing a broken water pipe, debating bottleneck technologies, and learning across functions—reflected the real spirit of being an engineer at APIE: practical, bold, and always improving.
With the launch of our upgraded Eagle Program 4.0, we’re investing not just in skills, but in people.
 
Our new “3-in-sync” development framework—aligning culture with professionalism, skills with innovation, and short-term goals with long-term vision—ensures every Eagle grows with structure, support, and strategic direction.
 
As Dr. Yang, our CEO, puts it:“We are preparing core talent not just for today’s production lines, but for a globally connected future.”
 
At APIE, we believe great teams don’t just build machines—they build each other.