On October 28, 2024, CEO Chen Shubin and CTO Yang Yang of Dongguan Touchpoint Intelligent Equipment Co., Ltd. led a team to visit Dean Cai of the School of Integrated Circuits of Peking University and his research team, and had in-depth exchanges and discussions on advanced packaging technology trends, project cooperation, and key technology research. They hope that through further cooperation, the talent advantages of top universities and the industrial advantages of enterprises can be integrated to promote the development of China's advanced packaging technology, and make more industry contributions to the major breakthroughs in solving the hard card replacement problem in China's semiconductor industry.