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COB Whole-Line Solution
The full name of COB is the automatic production line of chip on board packaging process for image camera modules. The image camera module is a complex system integrating light, machine, electricity, software, computing and hardware. It is generally composed of FPC substrate, CMOS photosensitive chip, infrared filter, optical lens, voice coil motor, passive components, drive IC, etc. COB whole line developed by APIE can fully automatically complete the assembly of the precision camera module, from the FPC board pasted with the passive components to the chip bonding, automatic cure, gold wiring, automatic pasting of filters, lens motors.Then coming out, the whole packaging process is completed, and that is a finished camera module.
Characteristics:
Automatic inline,input from first station and output from the last station.
Applicable to MP, needs less operators and low yield loss.
For UPH balance, the order and quantity of equipment of each station can be adjusted according to the process need.
Average UPH 1500-2300 pcs/H(Actual UPH would depend on process and carrier layout).
Product features
Specifications
Application case