Ultra-thin Memory Chip Bonder
Characteristics:
（1）High accuracy linear motor, applicable to ultra-thin chip die bonding, bonding platform with heating module;
（2）Flexible selection of picking modes (single head / double heads), optional single machine/inline, support SECS / GEM communications;
（3）Integrated track anti-dust module, chip stripping mode,compatible with thimble and multi-step top, compatible with 8-inch and 12-inch wafers;
（4）High accuracy visual positioning system, self-developed vibration suppression and elimination design, ink dot detection ;
（5）Support DAF function, support Wafer/Strip mapping, multi-layer wafer basket automatic loading
Application：
Memory ultra-thin chip bonding
High accuracy die multi-layer stack die bonding.
