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High speed Die Bonder
Characteristics:
(1)Applicable to 8-inch and below wafers;
(2)Four dispensing heads, dispensing patterns: dispensing, spraying and viscose;
(3)Ultra high speed linear motor, voice coil force control;
(4)Optional for single machine / inline, support SECS / GEM communication, Wafer /Strip mapping, automatic wafer loading;
(5)Epoxy detection, postbond detection, ink dot detection, mistake proofing for product direction , whole board UV curing (optional).

Application:
CCM camera module filter IR / DFN / QFN / LGA
Product features
Specifications
Application case